Aluminum and Copper Bonding Wires for Power Devices
The Standard for Power Devices
TANAKA Denshi Kogyo offers high-purity aluminum (Al) and copper (Cu) bonding wires (100 to 500µm) and ribbons (width 0.5 to 2.0mm) with excellent surface properties of automotive grade. As aluminum has excellent moisture resistance , it is often used in power device applications that drive high currents under harsh environments. We also have wires for power devices that use copper, which has even better electrical conductivity.
TAWN – Al Bonding Wire for Power Devices
Features
- Excellent corrosion resistance
- Excellent bondability
Cross Section after PCT
Long Winding Length
TABN – Al-1%Si Bonding Wire
Features
- Uniform distribution of Si
- Stable mechanical property.
- Good corrosion resistance under PCT.
Si Distribution in Wire
Loop Shape
TABR -Al Bonding Ribbon for Power Devices
Features
- Excellent corrosion resistance (Equal to TANW wire)
- Corresponds to a multi size.
Width 0.5mm～2.0mm
Thickness 0.10mm～0.30mm - Satisfactory surface smoothness
Cross Section after PCT
Standard Size of TABR
CP-1 -Cu Heavy Bonding Wire for Power Device
Features
- Excellent electrical conductivity (40% higher than Al)
- High fusing current（30% higher than Al）
- Available diameter（φ100～500μm）
Resistivity
Fusing Current
Technical Data Download
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