Active Brazing Filler Metals

Joining Technology

Active Brazing Filler Metals

Our active brazing filler metals enable direct ceramic brazing.

Our active brazing filler metals enable direct bonding of two ceramics, or ceramics to metals, regardless of whether they are oxides or nitrides, without metallization.


  • Enables direct bonding of ceramics without metalized layers
  • Provides bonding strength equivalent to or higher than conventional methods


Product Component Melting point Form Dimensions
TKC-661 AgCuSnTi alloy Approx. 780°C Sheet Width:
 110 mm or less
 0.05 mm or more
Wire Diameter:
 0.2 mm or more

Active Metal Brazing Method

Adding active metals such as titanium to conventional brazing filler metals provides improved wettability and bonding strength. With active brazing filler metals, bonding can be performed with a single heating, enabling the work to be done with less man-hours and shorter lead times.

  • Exterior of active brazing filler metal

  • Exterior after active brazing filler metal has
    been brazed


Bonding of ceramic jigs, engine components, electronic components for ceramic heat sinks, ceramic circuit boards, etc.

Enlarged photograph of the brazing layer

* Bonding conditions
Bonding should be carried out by conducting preplaced brazing under the following conditions:
In a vacuum of 1 x 10-3 Pa or less ; at a temperature of between 790 and 850°C; and with a melting time of 1 to 5 minutes

  • For power semiconductors Active brazing filler metal / copper composite

  • After brazing of composite

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