Precious Metal Film Formation Methods
Thick Film Pastes and Precious Metal Powders
We support further integration of electronic components and offer reliable quality.
Precious metal pastes, powders, and conductive adhesives are widely used in various applications, such as circuitry and semiconductor die bonding.
With our fine-tuned technology, we offer the best quality products for precision circuits.
Pastes for Electronic Parts and Circuitry
Features
- Integrated manufacturing, beginning with powdered materials, has enabled cost reduction
- Pastes are available to fit various applications
- Various lead-free pastes are available
| Applications | Conductor materials | Resistor materials | Dielectric materials |
|---|---|---|---|
|
Ag-Pd paste Ag-Pt paste Ag paste Cu paste Au paste |
RuO2 resistor paste Ag-Pd resistor paste |
Glass paste for: Cross-over Multilayer printing N2 firing Overcoat |
| Resistor | Ag paste Ag-Pd paste |
RuO2 resistor paste Ag-Pd resistor paste |
Glass paste for overcoat |
| Sensor | Pt paste Au paste |
Pt-Pd alloy paste RuO2 resistor paste |
Glass paste for overcoat |
| Laminated ceramic Device LTCC |
Ag paste Ag-Pt paste Ag-Pd paste Au paste |
RuO2 resistor paste Ag-Pd resistor paste |
Glass paste for overcoat |
| Tantalum capacitor | Ag paste for coating C paste Ag adhesive |
– | – |
| Thermal printer head | Au paste Au/MOD paste Ag paste |
RuO2 resistor paste | Glass paste for overcoat |
| Heater | Ag-Pd paste | Ag-Pd resistor paste | Glass paste for overcoat |
* MOD: Organometallic
Silver Adhesive Paste for Die-bonding
Features
- Support of power devices through high thermal heat conductivity
- Highly reliable general-purpose silver adhesive paste
| No. | Type | Volume resistivity（µΩ・cm） | Thermal conductivity（W/m・k） |
|---|---|---|---|
| TS-985 Series | Hybrid | 7 | 200 |
| TS-987 Series | Hybrid | 5 | 160 |
| TS-185 Series | Epoxy | 10 | 80 |
| TS-333 Series | Polyester | 25 | 23 |
| TS-175 Series | Epoxy | 32 | 13 |
※Hybrid＝Epoxy＋Sintering
| No. | Type | Volume resistivity（µΩ・cm） | Thermal conductivity（W/m・k） |
|---|---|---|---|
| TS-160 Series | Epoxy | 200 | 2.5 |
Precious Metal Powders for Pastes
Features
- Precise film formation is possible during sintering
- Capable of coping with highly diversified substrates and increasingly thin electrodes
- Various precious metal powders are available
| Product name | Tap Density(g/cc) | Mean Particle Size* (µm) | Specific Surface Area(m2/g) | |
|---|---|---|---|---|
| Platinum powder | AY-1010 | 3.0~7.0 | 1.0~10.0 | 0.5~3.0 |
| AY-1020 | 0.6~1.0 | 3.0~13.0 | 20.0~40.0 | |
| AY-1050 | 9.0~12.0 | 0.4~0.8 | 0.8~1.2 | |
| Silver powder | AY-6010 | 0.7~1.6 | 6.0~13.0 | 1.0~2.5 |
| AY-6080 | 3.5~4.5 | 0.2~1.0 | 1.5~3.0 | |
| Palladium powder | AY-4030 | 0.6~1.2 | 1.0~7.0 | 9.0~16.0 |
| AY-4054 | 4.0~7.0 | 0.3~1.4 | 0.4~1.7 | |
| AY-406 | 4.0~8.0 | 1.0~3.0 | 0.5~1.5 | |
| Gold powder | AY-5022 | 2.0~12.0 | 0.3~2.0 | 0.2~1.0 |
| Alloy powder | Ag-Pd | Various precious Metal alloy powders are also available. | ||
| Pt-Rh | ||||
| Pt-Pd | ||||
| Others | ||||
* Indicates 50% of the particle size measured by a particle size distribution analyzer.