Silver Adhesive Pastes for Die-bonding

Silver Adhesive Pastes for Die-bonding

Product image of silver adhesive pastes for die bonding

Diagram explaining the area where silver adhesive pastes for die bonding are used inside a semiconductor package

High Thermal Conductivity and High Reliability Ag Adhesive Pastes

Conductive adhesives for die bonding are used with Si for power devices and SiC and GaN next-generation semiconductors. Our lineup includes hybrid types that allow a balance of high thermal conductivity and high reliability and sintering types with high thermal conductivity exceeding 200W/m・K.

Overview of Silver Adhesive Pastes for Die Bonding

Features

  • Lineup of silver adhesive pastes with high thermal conductivity for different uses
  • Highly reliable automotive products with good records of performance
  • Alternative to high-temperature Pb solder pastes

Lineup of Major Products

Part No. Type Volume
resistivity
(µΩ・㎝)
Thermal
conductivity
(W/m・K)
Features Use
TS-985 series  Hybrid*
Sintering
7 130-240 Highly conductivity
Alternative to solder
High reliability
Automotive power IC
Power module
TS-987 series  Hybrid 5 160 Highly conductivity
Alternative to AuSn solder
LED
Laser diode
High-frequency module
TS-185 series  Epoxy 10 80 High conductivity
High reliability
Automotive power IC
LED
Laser diode
TS-333 series  Thermo-plastic 25 23 High conductivity
Low stress
Automotive power IC
TS-175 series  Epoxy 32 13 High conductivity
Low stress
Power IC
RF module
Laser diode
TS-160 series  Epoxy 200 2.5 High reliability LED
Laser diode
Other

* Hybrid = sintering + resin bonding

TANAKA Original Hybrid Sintering

Conceptual Images of Bonding

  • TS-160 and TS-175 series
    TS-185 and TS-333 series
    Conceptual image of die bonding: resin bonding
    Resin bonding
  • TS-985 series
    TS-987 series
    Conceptual image of die bonding: hybrid sintering
    Sintering + resin bonding
    hybrid sintering
  • TS-985 series
    Conceptual image of die bonding: sinteringSintering

Reliability and Features of Hybrid Sintering

  • Normal (hybrid) sintering structure

    Diagram explaining stress in normal sintering structure

    Very High Elastic modulus → High stress

  • TANAKA original hybrid sintering

    Diagram explaining stress in TANAKA original hybrid sintering

    Unique resin formulation → Lower stress

7x7mm Au sputtered chip/ Bare-CuLF (without mold resin)
Clack / delami length
Graph comparing heat cycle test results of TANAKA original hybrid sintering and normal sintering

SAT image after heat cycle test of normal sintering

SAT image after heat cycle test of TANAKA original hybrid sintering

TANAKA’s unique technology has realized good reliability.