Thick Film Pastes and Precious Metal Powders

Precious Metal Film Formation Methods

Thick Film Pastes and Precious Metal Powders

We support further integration of electronic components and offer reliable quality.

Precious metal pastes, powders, and conductive adhesives are widely used in various applications, such as circuitry and semiconductor die bonding. With our fine-tuned technology, we offer the best quality products for precision circuits.

Pastes for Electronic Parts and Circuitry

Features

  • Integrated manufacturing, beginning with powdered materials, has enabled cost reduction
  • Pastes are available to fit various applications
  • Various lead-free pastes are available
Applications and paste types
Applications Conductor materials Resistor materials Dielectric materials
Hybrid IC
• Alumina substrates
• Aluminum nitride substrates, etc
• LED, etc.
Ag-Pd paste Ag-Pt paste Ag paste Cu paste Au paste RuO2 resistor paste Ag-Pd resistor paste Glass paste for: Cross-over Multilayer printing N2 firing Overcoat
Resistor Ag paste Ag-Pd paste RuO2 resistor paste Ag-Pd resistor paste Glass paste for overcoat
Sensor Pt paste Au paste Pt-Pd alloy paste RuO2 resistor paste Glass paste for overcoat
Laminated ceramic Device LTCC Ag paste Ag-Pt paste Ag-Pd paste Au paste RuO2 resistor paste Ag-Pd resistor paste Glass paste for overcoat
Tantalum capacitor Ag paste for coating C paste Ag adhesive
Thermal printer head Au paste Au/MOD paste Ag paste RuO2 resistor paste Glass paste for overcoat
Heater Ag-Pd paste Ag-Pd resistor paste Glass paste for overcoat

* MOD: Organometallic

Silver Adhesive Paste for Die-bonding

Features

  • Support of power devices through high thermal heat conductivity
  • Highly reliable general-purpose silver adhesive paste
High Thermal Conductivity Silver Adhesive Paste
No. Type Volume resistivity(µΩ・cm) Thermal conductivity(W/m・k)
TS-985 Series Hybrid 7 200
TS-987 Series Hybrid 5 160
TS-185 Series Epoxy 10 80
TS-333 Series Polyester 25 23
TS-175 Series Epoxy 32 13

※Hybrid=Epoxy+Sintering

General-purpose Silver Adhesive Paste
No. Type Volume resistivity(µΩ・cm) Thermal conductivity(W/m・k)
TS-160 Series Epoxy 200 2.5

Precious Metal Powders for Pastes

Features

  • Precise film formation is possible during sintering
  • Capable of coping with highly diversified substrates and increasingly thin electrodes
  • Various precious metal powders are available
Main Types and Features of Powders
Product name Tap Density(g/cc) Mean Particle Size* (µm) Specific Surface Area(m2/g)
Platinum powder AY-1010 3.0~7.0 1.0~10.0 0.5~3.0
AY-1020 0.6~1.0 3.0~13.0 20.0~40.0
AY-1050 9.0~12.0 0.4~0.8 0.8~1.2
Silver powder AY-6010 0.7~1.6 6.0~13.0 1.0~2.5
AY-6080 3.5~4.5 0.2~1.0 1.5~3.0
Palladium powder AY-4030 0.6~1.2 1.0~7.0 9.0~16.0
AY-4054 4.0~7.0 0.3~1.4 0.4~1.7
AY-406 4.0~8.0 1.0~3.0 0.5~1.5
Gold powder AY-5022 2.0~12.0 0.3~2.0 0.2~1.0
Alloy powder Ag-Pd Various precious Metal alloy powders are also available.
Pt-Rh
Pt-Pd
Others

* Indicates 50% of the particle size measured by a particle size distribution analyzer.