Silver Alloy Bonding Wires

Silver Alloy Bonding Wires

Giving Form to the Technologies of a Precious Metal Maker

Silver has the highest conductivity and thermal conductivity. But it easily become sulfurized and had a problem in durability. TANAKA Denshi Kogyo K.K. has solved these problems and is successfully marketing the results as commercial products. Silver materials are less expensive than gold materials, customers can reduce material costs by about 80%.

SEA / SEC – Ag Alloy Bonding Wire

Features

  • Reduce material cost with good bondability
  • High reflectivity in short wavelength range
  • Low resistivity(SEC type)
  • Softer FAB(SEC type)

Resistivity

Reflectivity

FAB compression

Wire dia. : 20μm
FAB dia. : 38μm
Equipment : MCT-W500(SHIMADZU)
Compression : FAB dia.×20%(8μm)

Reliability

uHAST 110degC × 85%RH
Wire Diameter : 18μm
Halogen Free Resin
pH : 6.0-7.0 Cl content : 15ppm
(without ion trapper)

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About TANAKA Denshi Kogyo, Supporting the Semiconductor Industry

Creation of a New Business Starting From Bonding Wires

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