Silver Alloy Bonding Wires

Silver Alloy Bonding Wires

Giving Form to the Technologies of a Precious Metal Maker

Silver has the highest conductivity and thermal conductivity. But it easily become sulfurized and had a problem in durability. TANAKA Denshi Kogyo K.K. has solved these problems and is successfully marketing the results as commercial products. Silver materials are less expensive than gold materials, customers can reduce material costs by about 80%.

SEA / SEC – Ag Alloy Bonding Wire


  • Reduce material cost with good bondability
  • High reflectivity in short wavelength range
  • Low resistivity(SEC type)
  • Softer FAB(SEC type)



FAB compression

Wire dia. : 20μm
FAB dia. : 38μm
Equipment : MCT-W500(SHIMADZU)
Compression : FAB dia.×20%(8μm)


uHAST 110degC × 85%RH
Wire Diameter : 18μm
Halogen Free Resin
pH : 6.0-7.0 Cl content : 15ppm
(without ion trapper)

Technical Data Download

Technical data is provided upon request.
Please click below to enter required information.

Download technical data

About TANAKA Denshi Kogyo, Supporting the Semiconductor Industry

Creation of a New Business Starting From Bonding Wires

Contact TANAKA for more information on products and case studies. Online enquiries 24 hours a day!

Contact us for further information or materials (24 hours a day)