Gold and Gold Alloy Bonding Wires

Gold and Gold Alloy Bonding Wires

More than 50 Years of Trust and Experience

Gold (Au) and gold alloy bonding wires with high performance continue to support the semiconductor industry. They boast chemical stability and excellent electrical conductivity not found in other metals. Through material development, we can achieve functions such as fine pitch and low loop while maintaining high purity.

HAZ Length and Wire Breaking Load [Au Wire dia. 25um]

GSA / GSB – Au Bonding Wire for Stable Stitch Bond


  • Stable stitch bond on QFN,QFP, BGA packages.
  • Good 2nd bond stitch remaining after pull test.
  • Good squashed ball shape and excellent FAB softness.

Stable Stitch Bond on QFN Packages(PPF, 175℃)

After Stitch Pull Test

Squashed Ball Roundness

GFC / GFD – Au Bonding Wire for Fine Pitch Bonding


  • Small deformation of squashed ball by ultrasonic frequency.
  • Wide actual bond area with suitable ultrasonic power.
  • Applicable for narrow pad pitch bonding.

Ball Shape

Upper  FAB : 38µm  SBD : 45µm
Middle FAB : 51µm  SBD : 60µm
Lower  FAB : 62µm  SBD : 75µm

35µm BPP Bonding

Wire : GFCφ15µm
Bonder : Shikawa UTC-3000
Pad Opening : 2µm

Scatter Diagram at 35µm BPP Bonding

GPH – High Reliability Au Alloy Bonding Wire


  • Higher bond reliability with halogen free compound

GLF – Super Low Loop Au Bonding Wire


  • Lower loop height than conventional low loop wires.
  • Less damage at neck region.
  • Suppression of snake-wire.
  • Higher pull load than conventional low loop wires.

GMG – High Strength Au Bonding Wire


  • High tensile strength wire enables cost reductions with finer diameters.
  • Applicable for multiple loop profiles used in BGA.
  • Excellent bump formation for a stack die package.

Mechanical Properties

Technical Data Download

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About TANAKA Denshi Kogyo, Supporting the Semiconductor Industry

Creation of a New Business Starting From Bonding Wires

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