Gold and Gold Alloy Bonding Wires

Gold and Gold Alloy Bonding Wires

More than 50 Years of Trust and Experience

Gold and Gold Alloy Bonding Wires with high performance that have supported the semiconductor industry. Especially, the key feature is the outstanding performance of electrical conductivity, corrosion resistance, workability and chemical stability.

GSA / GSB – Au Bonding Wire for Stable Stitch Bond

Features

  • Stable stitch bond on QFN,QFP, BGA packages.
  • Good 2nd bond stitch remaining after pull test.
  • Good squashed ball shape and excellent FAB softness.

Stable Stitch Bond on QFN Packages(PPF, 175℃)

After Stitch Pull Test

Squashed Ball Roundness

GFC / GFD – Au Bonding Wire for Fine Pitch Bonding

Features

  • Small deformation of squashed ball by ultrasonic frequency.
  • Wide actual bond area with suitable ultrasonic power.
  • Applicable for narrow pad pitch bonding.

Ball Shape

35µm BPP Bonding

Scatter Diagram at 35µm BPP Bonding

GPH – High Reliability Au Alloy Bonding Wire

Features

  • Higher bond reliability with halogen free compound

GLF – Super Low Loop Au Bonding Wire

Features

  • Lower loop height than conventional low loop wires.
  • Less damage at neck region.
  • Suppression of snake-wire.
  • Higher pull load than conventional low loop wires.

GMG – High Strength Au Bonding Wire

Features

  • High tensile strength wire enables cost reductions with finer diameters.
  • Applicable for multiple loop profiles used in BGA.
  • Excellent bump formation for a stack die package.

Mechanical Properties

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About TANAKA Denshi Kogyo, Supporting the Semiconductor Industry

Creation of a New Business Starting From Bonding Wires

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