Gold and Gold Alloy Bonding Wires
More than 50 Years of Trust and Experience
Gold and Gold Alloy Bonding Wires with high performance that have supported the semiconductor industry. Especially, the key feature is the outstanding performance of electrical conductivity, corrosion resistance, workability and chemical stability.
HAZ Length and Wire Breaking Load [Au Wire dia. 25um]
GSA / GSB – Au Bonding Wire for Stable Stitch Bond
Features
- Stable stitch bond on QFN,QFP, BGA packages.
- Good 2nd bond stitch remaining after pull test.
- Good squashed ball shape and excellent FAB softness.
Stable Stitch Bond on QFN Packages（PPF, 175℃）
After Stitch Pull Test
Squashed Ball Roundness
GFC / GFD – Au Bonding Wire for Fine Pitch Bonding
Features
- Small deformation of squashed ball by ultrasonic frequency.
- Wide actual bond area with suitable ultrasonic power.
- Applicable for narrow pad pitch bonding.
Ball Shape
35µm BPP Bonding
Scatter Diagram at 35µm BPP Bonding
GPH – High Reliability Au Alloy Bonding Wire
Features
- Higher bond reliability with halogen free compound
GLF – Super Low Loop Au Bonding Wire
Features
- Lower loop height than conventional low loop wires.
- Less damage at neck region.
- Suppression of snake-wire.
- Higher pull load than conventional low loop wires.
GMG – High Strength Au Bonding Wire
Features
- High tensile strength wire enables cost reductions with finer diameters.
- Applicable for multiple loop profiles used in BGA.
- Excellent bump formation for a stack die package.
Mechanical Properties
Technical Data Download
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