Gold and Gold Alloy Bonding Wires
More than 50 Years of Trust and Experience
Gold (Au) and gold alloy bonding wires with high performance continue to support the semiconductor industry. They boast chemical stability and excellent electrical conductivity not found in other metals. Through material development, we can achieve functions such as fine pitch and low loop while maintaining high purity.
HAZ Length and Wire Breaking Load [Au Wire dia. 25um]
GSA / GSB – Au Bonding Wire for Stable Stitch Bond
Features
- Stable stitch bond on QFN,QFP, BGA packages.
- Good 2nd bond stitch remaining after pull test.
- Good squashed ball shape and excellent FAB softness.
Stable Stitch Bond on QFN Packages（PPF, 175℃）
After Stitch Pull Test
Squashed Ball Roundness
GFC / GFD – Au Bonding Wire for Fine Pitch Bonding
Features
- Small deformation of squashed ball by ultrasonic frequency.
- Wide actual bond area with suitable ultrasonic power.
- Applicable for narrow pad pitch bonding.
Ball Shape
Upper FAB : 38µm SBD : 45µm
Middle FAB : 51µm SBD : 60µm
Lower FAB : 62µm SBD : 75µm
35µm BPP Bonding
Wire : GFCφ15µm
Bonder : Shikawa UTC-3000
Pad Opening : 2µm
Scatter Diagram at 35µm BPP Bonding
GPH – High Reliability Au Alloy Bonding Wire
Features
- Higher bond reliability with halogen free compound
GLF – Super Low Loop Au Bonding Wire
Features
- Lower loop height than conventional low loop wires.
- Less damage at neck region.
- Suppression of snake-wire.
- Higher pull load than conventional low loop wires.
GMG – High Strength Au Bonding Wire
Features
- High tensile strength wire enables cost reductions with finer diameters.
- Applicable for multiple loop profiles used in BGA.
- Excellent bump formation for a stack die package.
Mechanical Properties
Technical Data Download
Technical data can be downloaded from the banner below.
