Copper and Copper Alloy Bonding Wires
The best product to reduce costs.
Copper and Copper Alloy Bonding Wires reduce costs approximately 90% compared to that of gold wires. In addition, these bonding wires feature excellent electrical characteristics including electrical conductivity and fusing current, making possible use in various devices including discrete semiconductors, QFP, and BGA. We also offer copper alloy wire and copper wire with a precious metal coating to enhance reliability.
CFB-1 – Standard Bare Cu Wire
■Features
- Excellent stitch bond-ability and wide bonding parameter window
- Stable continuous bond-ability
■Continuous Bonding 2nd Pull Test
CA-1 – High Reliability Cu Alloy Bonding Wire
■Features
- Higher bond reliability
- Wider bonding window
- Lower resistivity
■Bond Reliability
■2nd Bond Process Window
CLR-1A – High Performance Cu Bonding Wire
■Features
- High and stable bondability
- Excellent reliability
- Wide bonding window
■FAB Shape and Roundness
■2nd Bondability
■Reliability
Storage Condition:130。C 85%
Failure ＝ΔR/R0>10%
Wire Diameter : 25μm
BGA Substrate（FR-4）
Mold resin : Conventional type
Technical Data Download
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